Silicon Box’s $200 M Series B funding raise brings its valuation to over $1 B
Silicon Box, a semiconductor packaging company based in Singapore, has revealed the completion of a $200 million Series B fundraising round, increasing its valuation to over $1 billion.
All three of Silicon Box’s founders participated in the funding round, the company said in a statement on Monday.
BRV Capital, Event Horizon Capital, Grandfull Convergence Fund, Hillhouse Capital, Lam Capital’s corporate venture arm, Maverick Capital, Prasedium Capital, Tata Electronics, TDK Ventures, and UMC Capital are among the other strategic investors in Silicon Box.
Additionally, Silicon Box disclosed that, since October 2023, a short time after the facility’s official opening on July 20, 2023, its cutting-edge $2 billion packaging factory in Singapore has been producing large quantities of goods for early clients.
For round-the-clock operations, the 750,000-square-foot facility has increased hiring.
In order to quickly increase production, the company has successfully closed Series B funding and is already projecting high demand on its current capacity.
Cutting-edge chiplet integration services are Silicon Box’s area of expertise as a cutting-edge semiconductor packaging company.
Dr. Sehat Sutardja, Weili Dai, and Dr. Byung Joon (BJ) Han, three titans of the semiconductor design and packaging industries, founded the company in 2021.
Together, Sutardja and Han have a lengthy history of working together and hold more than 800 US patents.
Silicon Box’s cutting-edge Singaporean factory provides efficient chiplet integration capabilities. In 2015, the chiplet concept was unveiled.
Han, the creator of semiconductor packaging goods, presently ships more than 100 billion units a year, including quad flat no-lead (QFN) products.
“Silicon Box is well poised to solve the semiconductor industry’s challenges for fast adoption of chiplet. We are leading the pack to bring high performance, power-optimized, affordable, and scalable solutions that enable next-gen large language models (LLM), generative artificial intelligence (AI), automotive, data centers, and mobile computing globally,” said Han.
“Our state-of-the-art factory and advanced panel level packaging are delivering a solution to scale high growth markets, such as AI accelerators, to the masses,
“This is our first multibillion-dollar factory and we are eager to scale rapidly to support our customers and partners,” he added.
With its innovative approach to semiconductor package design and fabrication, Silicon Box claims that it will revolutionize everything from the most complex edge systems or artificial intelligence (AI) systems to the most basic circuits.
The company claims that conventional packaging techniques are limiting the scalability of current semiconductor chips.
